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Product Information

Wafer Marking System

Wafer Marking System

Small footprint.

  • Feature
  • Specification

Features

This system is for marking on wafers; silicon wafer, sapphire substrate, and compound wafer.

  • Small footprint.
  • Highly precise marking.
  • High throughput.

[White marking: by SHG laser]
It melts only surface of a silicon wafer, so marking can be done without particles.

White marking

[Black marking: by fundamental laser]
It engraves surface of a silicon wafer. Marked workpiece has a high level of visibility and can be read clearly even after cleansing and grinding.

Black marking

Inside of the system

Control display

  • Feature
  • Specification