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Inner Glass Marking System

Inner-glass Marking System

Performing parallel processing for the loading/unloading of substrates and marking with multiple laser heads achieve a high throughput.

  • Feature
  • Specification

Specifications

Laser SHG or THG laser
Marking area Φ30mm
Spot size Φ5µm
Substrate size Size: Up to the eighth generation substrate, thickness: 0.7mm or thicker
Takt time 50 sec. *
Marking positioning accuracy 200µm
Workpiece conveying method Belt conveyor
Focus Auto-focus

*In case of processing four sides of the eighth generation substrate by two heads.